Micro blasting is the new micro-processing or fine-processing and MEMS technology. Applications : Machining, Etching, Boring, Drilling, Grooving, Peeling. Materials : Glass, Ceramics, Silicon etc.

Micro blasting technology allows highly accurate thin line machining to 20 micron.

Micro blasting technology has made obsolete existing technologies such as ultrasonic,
laser processing, etching and micro drilling. Microblasting is excellent for applications
of hard-brittle materials including glass, ceramics, and silicon. Micro blasting machines
is also highly effective for micro-processing of electronic devices, semiconductors,
Flat Panel Display components and many process capability.

Grooving of Glass	Drilling of Glass	Etching of Ceramics
20micron Line Grooving

A highly precise micro abrasive jet machining technology using fine abrasive
particles of 3-40micron.

In the micro blasting process, there are two typical processing methods. The first is to
perform blasting on the entire surface of a rather broad area of work pieces. This can
bedone or without a specified pattern by using a blasting nozzle from 4 to 10mm diam.
These and is to perform concentrated spot blasting on minute parts set at the blasting
position without the mask by using the nozzle having a small blasting hole of
approximately0.15mm diam..

Efficient and Uniformed Blasting on a broad surface.	Concentrated spot blasting without masking.

The combination of our Programmed Constant Quantity Feeding Device (Patent Registered) and Foreign Materials Separator, performs accurate and stable machining.	The Micro-nozzle's concentrated spot blasting performs with can perform a higher efficiency and excellent aspect ratio.
(Micro Blasting Machines MB1)	( Micro Blasting Machines MB2)

Features and Advantages
◇ Dry process(no chemicals) ◇ Less deterioration ◇ Complicated patterns are possible ◇ Can process numerous materials	◇ Less chipping and cracking ◇ High productivity ◇ Lower initial cost ◇ Less damage to workpiece

Mask Aligner

Micro blasting by MB1

Masked Sample
(Before Microblasting)

After Microblasting

Machining Accuracy

● Line width 20micron (plus or minus 5micron)
● Hole diameter 30micron (plus or minus 5micron)
● Chipping approximately 10micron
The best abrasive jet machining
level in the world

Drilling of Glass Substrate by MB2

1.Machining characteristic and accuracy of the Microblasting Process

The accuracy achievable by microblasting is on the level of 10micron while running at high
productivity. The Microblasting process is flexible as well as productive allowing operations
such as grinding, electron beam processing and etching that require an accuracy level of
1 micron. Operations such as machining and electric-discharge processing requires an
accuracy of more or less 100micron.

2.High processing grade

By use of the Foreign Materials Separator and a Cyclone for fine particles, the abrasives are
recycled in the system and used repeatedly by separating fine dust and coarsewastes
generated from the system that are no longer contributable to the process. These separating
mechanisms are also effective forpreventing damages of process materials and for stabilizing
the result of microblasting process.

●Chipping：Approximately 5micron
●Surface roughness：0.02micronRa

3.High productivity while machining complicated patterns

The Micro blasting machines can machine various patterns, at a productive rate, by use of the Blasting
Condition Control System, the Numerical Controlled Processing Table and using the
Photoresist Mask.

●High productivity
●Machining of complicated patterns
●Complicated three-dimensional configuration can be materialized

Micro Blasting Machines MB1	＜Ｓｐｅｃｉｆｉｃａｔｉｏｎｓ＞
	Abrasive	♯220～♯800
	Abrasive feed	Constant feeding device
	Abrasive reclaimer	Special cyclone device
	Separation of foreign materials	Coarse particle separator
	Equipment dimensions (mm)	1000W×1400L×1500H

Micro blasting technology proposes the newest solution related to research,
development, machining, manufacture, in the field of micro-processing and Micro
Electro Mechanical Systems (MEMS).
Please consider Microblasting technology, and see why it is the best new micro-
processing technology.

Machining Accuracy ● Line width 20micron (plus or minus 5micron) ● Hole diameter 30micron (plus or minus 5micron) ● Chipping approximately 10micron The best abrasive jet machining level in the world Drilling of Glass Substrate by MB2

Machining Accuracy

● Line width 20micron (plus or minus 5micron)
● Hole diameter 30micron (plus or minus 5micron)
● Chipping approximately 10micron
The best abrasive jet machining
level in the world

Drilling of Glass Substrate by MB2