* Roughening wafer chucks
* Drilling of electrodes for Plasma etching
* Forming holes completely through IC packages
* Etching of silicon wafer
* Boring of glass wafer
* Etching of ceramics wafer susceptor
Etching of silicon wafer

* Roughening reverse surfaces of SAW filter
substrate
* Forming electrodes of ceramic filters
* Grooving of printer heads
* Etching of crystal device
* Stain removal and micro deburring of
condensers
* Drilling of sensor glass substrate
* Suface cleaning of IC package
Surface cleaning of IC package

* Forming ribs on PDP
* Grooving of LCD glass substrate
* Etching of metallic mold for LCD filter
* Etching of OELD cover glass
* Peeling thin firm layer of silicon substrate or
glass substrate
Etching of glass substrate

* The micro-stracture is etched and formed on
PZT piezoelectric materials

Deburring of Aluminum Board
before
after
* Etching of metallic foils (aluminum,copper) * Cutting of quartz glass
* Rib forming of alumina substrate * Roughening metallic mold
* Etching of stainless steel * Deburring of metallic parts

Materials
*Glass *Silicon
*Ceramics *Cardon
*Al3N4 *Al3O3
*Quartz *Sapphire
*Metal etc.(Stainless steel,steel etc.)
Applications
*Grooving *Boring *Through hole *Via hole
*Etching *Cutting *Cleaning *Deburring
*Peeling *Slitting *Patterning *Dicing
*Gettering *Marking *De-marking *De-smear
*Beveling *Roughening *Forming etc.



Glass Ceramics Silicon Others

Drilling
Drilling
Electrode forming of
Ceramic filter

Etching of Metal

Grooving
Deburring of IC package

Etching
Deburring of Aluminum Board


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