Microblasting is a new Dry Etching method that can replace Wet Etching,
Ultrasonic and Laser Processing
 
Microblasting technology allows highly accurate thin line machining to
20micron.
Microblasting technology has made obsolete existing technologies such as ultrasonic,
laser processing, etching and micro drilling. Microblasting is excellent for applications
of hard-brittle materials including glass, ceramics, and silicon. Micro blasting machines
is also highly effective for micro-processing of electronic devices, semiconductors,
Flat Panel Display components and many process capability.
Grooving of Glass
Drilling of Glass
Etching of Ceramics

20micron Line Grooving

Microblasting technology proposes the newest solution related to research, development,
machining, manufacture, in the field of micro-processing and Micro Electro Mechanical
Systems (MEMS).
Please consider Microblasting technology, and see why it is the best new micro-processing
technology.

Please Contact us you with questions about our website or products.

E-mail:m-higuchi@sinto.co.jp

51 Shinmei,Ubukuji,Kitanagoya, Aichi, Japan 481-8678

TEL:81-568-22-1141 FAX:81-568-23-0184





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