|
SEMICONDUCTORS
|
|
|
●
●
●
●
●
●
|
Roughening wafer chucks
Drilling of electrodes for Plasma etching
Forming holes completely through IC packages
Etching of silicon wafer
Boring of glass wafer
Etching of ceramics wafer susceptor |
|
Etching of silicon wafer
|
|
|
|
|
|
|
ELECTRONIC COMPONENTS
|
|
|
●
●
●
●
●
●
●
|
Roughening reverse surfaces of SAW filter
substrate
Forming electrodes of ceramic filters
Grooving of printer heads
Etching of crystal device
Stain removal and micro deburring of condensers
Drilling of sensor glass substrate
Suface cleaning of IC package |
|
Surface cleaning of IC package
|
|
|
|
|
|
|
FLAT PANEL DISPLAYS RELATED
|
|
|
●
●
●
●
●
|
Forming ribs on PDP
Grooving of LCD glass substrate
Etching of metallic mold for LCD filter
Etching of OELD cover glass
Peeling thin firm layer of silicon substrate or
glass substrate |
|
Etching of glass substrate
|
|
|
|
|
|
|
MEMS
|
|
|
●
|
The micro-stracture is etched and formed on
PZT piezoelectric materials |
|
|
|
|
OTHERS
|
Deburring of Aluminum Board
before
after |
●
●
●
●
●
● |
Etching of metallic foils (aluminum,copper)
Cutting of quartz glass
Rib forming of alumina substrate
Roughening metallic mold
Etching of stainless steel
Deburring of metallic parts |
